Elevate your testing capabilities with XPCB Limited's high-performance ATE PCB Assembly. Our cutting-edge technology, including POFV (Plated Over Filled Via) and back drilling, guarantees superior signal integrity, while our HDI (High-Density Interconnect) fabrication supports intricate designs with fine pitch components and trace widths up to 40:1 aspect ratios. Trust XPCB to flawlessly execute your complex PCB requirements, ensuring reliability in the most demanding test environments. For inquiries, contact us at +86-136-3163-3671.